Bluetooth LE Audio Revolutionizes Wireless Audio

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About Colin Ramrattan

Colin Ramrattan has been with STMicroelectronics since 2012 and is a Product Marketing Engineer with the microcontroller product marketing team for the Americas. Colin has held positions in both the analog sensors and connectivity organization prior to microcontrollers. Before joining ST, Colin was a user interface module designer at Blackberry in Waterloo, Canada.

About Salvo Bonina

Principal Application Engineer, Wireless Products at STMicroelectronics

Salvo has been working for ST since 2002 with different roles and in multiple organizations. He now supports the ST customers in the America region for the ST wireless products on the Firmware aspects.

About STMicroelectronics

Electronic circuits form a mostly invisible part of the world we live in today. These circuits are present in microchips or just "chips", which combine the latest advances in performance, intelligence and, efficiency. Hundreds or thousands of these chips are integrated into each of the millions and billions of electronic devices people across the globe interact with every day. It is in this unseen realm that STMicroelectronics creates the sparks that animate the products we use at any given moment. Our technology is found everywhere microelectronics makes a positive contribution to people's lives. Chips from ST embedding the most advanced innovations are an essential part of products as diverse as cars and key fobs, giant factory machines and data center power supplies, washing machines and hard disks, and smartphones and toothbrushes. We help our customers make these devices more intelligent, more energy efficient, more connected, safer and more secure.

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Bluetooth LE Audio Revolutionizes Wireless Audio

Colin Ramrattan - Salvo Bonina - STMicroelectronics - Watch Now - Duration: 34:26

Abstract Questions & Comments (7)

Explore Bluetooth® LE Audio with Auracast™ & STMicroelectronics’ STM32WBA MCU solution. Auracast™ enables audio broadcast capabilities to Bluetooth LE devices and opens new use cases such as shared audio experiences and assistive listening.

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Nathan3

Score: 0 | 1 day ago | 2 replies

What are the difference in memory usage (RAM and FLASH) between the full and the basic BLE stack ?

sb_FAE

Score: 0 | 1 hour ago | no reply

This post has been deleted by the author

ST_Wireless_MarketingSpeaker

Score: 0 | 2 hours ago | no reply

Hello Nathan,
Regarding the ram and flash usage, there is an update coming to :
AN5928 which is your reference document for both stacks.
Today we have the following as a guideline but subject to change as fixes and improvements are implemented:
Basicstack_Beacon application: Flash: 116Kbyte, SRAM 14.3Kbyte
Fullstack_Beacon P2P Server application: Flash: 226Kbyte, SRAM 24.1Kbyte

bradstew

Score: 0 | 22 hours ago | 1 reply

What is the typical audio latency?

sb_FAE

Score: 0 | 3 hours ago | no reply

In LE Audio the latency is <30ms

cijart

Score: 0 | 12 hours ago | no reply

very nice

bradstew

Score: 0 | 22 hours ago | no reply

This post has been deleted by the author

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About Colin Ramrattan

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About STMicroelectronics

Bluetooth LE Audio Revolutionizes Wireless Audio

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